QFN32 QFN40 to DIP Adapter PCB - 0.5mm Double-Sided Converter

Specifications

• Board Length: 40.64mm (1.6 inches)

• Board Width: 12.70mm (0.5 inches)

• Pitch (Both Sides): 0.5mm

• Material: High-quality FR-4 Glass Fiber

• DIP Output Pitch: Standard 2.54mm (0.1 inch)

• DIP Row Spacing: Standard 15.24mm (0.6 inch)

• Number of Pins: Supports 32-pin and 40-pin configurations

Key Applications & Projects

• Advanced Microcontroller Development: Test 32-pin or 40-pin QFN microcontrollers on a standard breadboard.

• High-Density Logic Prototyping: Break out miniaturized logic gates or signal processors for easy wiring.

• Component Salvaging: Reuse high-performance SMD ICs from salvaged electronics in new through-hole prototypes.

Unlock New Capabilities (Project Evolution)

• Feature Upgrade: Both sides include a central area for chips requiring a thermal or ground connection, ensuring high-performance components stay cool during operation.

• Effort Level: Advanced. Requires high-precision soldering or a hot air rework station due to the leadless nature of QFN and the 0.5mm pitch.

Package Includes:

• 1 x QFN32 / QFN40 to DIP Double-Sided Adapter PCB

FREQUENTLY ASKED QUESTIONS (FAQ)

1. Can I mount components on both sides at once? No, the through-holes for the DIP headers are shared; you should only mount one component per board.

2. What is the lead pitch for this board? Both sides feature a precision 0.5mm lead pitch.

3. Will this fit a standard breadboard? Yes, it converts the SMD pins to standard 2.54mm spacing for all breadboards.

4. Are the header pins included? No, 2.54mm male header pins are sold separately.

5. What is the size of the board? The board measures 40.64mm in length and 12.70mm in width.

6. Does it have a thermal pad? Yes, both sides include central pads for chips requiring a thermal or ground connection.

7. Which side is for the QFN32? Use the side labeled "QFN32" which has a 4.80mm center pad.

8. Which side is for the QFN40? Use the side labeled "QFN40" which has a 6.00mm center pad.

9. Do I need a special iron for this? A hot air rework station is highly recommended for leadless QFN packages.

10. How do I identify Pin 1? Pin 1 is indicated by a white dot or square pad on the silk screen.

11. Is the PCB material heat-resistant? Yes, the FR-4 material is rated for standard soldering temperatures.

12. Can I use this for 28-pin chips? While possible if the pitch matches, it is specifically optimized for 32 and 40 pin packages.

13. How many pins are broken out? Up to 40 pins can be broken out to the standard DIP spacing.

14. What is the diameter of the output holes? They are sized for standard 2.54mm pin headers.

15. What color is the PCB? The standard board is green with white silk screening.

16. Is there a mounting hole? No, the board is held in place by its header pins.

17. Can I reuse the board? If the component is desoldered carefully with hot air, the PCB can be reused.

18. What gauge wire fits the holes? Standard 22AWG solid wire or 2.54mm header pins are ideal.

19. What is the row spacing for the DIP output? It is standard 0.6-inch (15.24mm) spacing.

20. Why are there two different side designs? Different high-density ICs use varying pin counts and center pad sizes; this dual-sided design maximizes compatibility.