QFN56 QFN64 to DIP Adapter PCB - 0.5mm Double-Sided Converter

Specifications

• Board Dimensions: 33mmx33mm

• Material: High-quality FR-4 Glass Fiber

• Pitch (Both Sides): 0.5mm

• DIP Output Pitch: Standard 2.54mm

• Thermal Pad: Integrated center ground pad on both sides for heat dissipation

• Number of Pins: Supports 56-pin and 64-pin configurations

Key Applications & Projects

• High-Pin-Count MCU Development: Prototype with 64-pin microcontrollers on a standard breadboard.

• Component Salvaging: Reuse 56-pin or 64-pin SMD ICs from salvaged electronics in new through-hole projects.

• High-Speed Logic Prototyping: Break out miniaturised logic gates or signal processors for easy wiring and oscilloscope probing.

Unlock New Capabilities (Project Evolution)

• Feature Upgrade: Both sides include a central exposed thermal pad, critical for high-performance chips that require a ground or heat-sink connection to prevent overheating during operation.

• Effort Level: Advanced. Requires high-precision soldering or a hot air rework station due to the leadless nature of QFN and the 0.5mm pitch.

Package Includes:

• 1 x QFN56 / QFN64 to DIP Double-Sided Adapter PCB

FREQUENTLY ASKED QUESTIONS (FAQ)

1. Can I mount components on both sides at once? No, the through-holes for the DIP headers are shared; you should only mount one component per board.

2. What is the lead pitch for this board? Both sides feature a precision 0.5mm lead pitch.

3. Will this fit a standard breadboard? It breaks out into four rows of pins; you will likely need jumper wires or a specialized wide-socket setup to interface with standard breadboard channels.

4. Are the header pins included? No, 2.54mm male header pins are sold separately.

5. What is the size of the board? The board is a square measuring 33mmx33mm.

6. Does it have a thermal pad? Yes, both sides include a central area for chips requiring a thermal or ground connection.

7. Which side is for the QFN64? Use the side labeled "QFN64" which has a 9.15mm center pad.

8. Which side is for the QFN56? Use the side labeled "QFN56" which has an 8.10mm center pad.

9. Do I need a special iron for this? A hot air rework station is highly recommended for leadless QFN packages due to the lack of external legs.

10. How do I identify Pin 1? Pin 1 is indicated by a white dot or square pad on the silk screen.

11. Is the PCB material heat-resistant? Yes, the FR-4 material is rated for standard soldering temperatures.

12. Can I use this for 48-pin chips? While possible if the pitch matches and the chip is centered, it is specifically optimized for 56 and 64 pin packages.

13. How many pins are broken out? Up to 64 pins can be broken out to the standard DIP spacing.

14. What is the diameter of the output holes? They are sized for standard 2.54mm pin headers.

15. What color is the PCB? The standard board is green with white silk screening.

16. Is there a mounting hole? No, the board is held in place by its header pins.

17. Can I reuse the board? If the component is desoldered carefully with hot air, the PCB can be reused.

18. What gauge wire fits the holes? Standard 22AWG solid wire or 2.54mm header pins are ideal.

19. What is the center pad size for the QFN64 side? It is approximately 9.15mm wide.

20. Why are there two different side designs? Different high-density ICs use varying pin counts and center pad sizes; this dual-sided design maximizes compatibility for 64-pin and 56-pin standards.