Heat Sink Paste Thermal Grease Compound for CPU Syringe

₹99.00
In stock
SKU
PRO852

This is a syringe of heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you’re connecting a component to a heatsink, it’ll really help to dissipate even more potentially damaging heat. This HY500 series thermal grease offer better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink.

It has a thermal conductivity of 1.172 W/(mK), which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.

Features

  • Color: Grey
  • Weight(N.W) 3g (as the picture)
  • Thermal conductivity > 1.172 W/m-k
  • Thermal Impedance <0.225
  • Specific Gravity >2.0
  • Viscosity 1000
  • Thixotropic Index 380+_10
  • Viscosity -50~300
  • Operation Temperature -30~300
  • Silicone Compounds 50%
  • Carbon Compounds 30%
  • Metal Oxide Compounds 20%
  • Graphite Thermal Grease,thermal Conductivity 1.93W/m-k~2.15W/m-k
  • Good Electric Insulating, Breakdown 10Kv voltage
  • Low Thermal Impedance,Keep grease condition with long time
  • With a wide range working temperature, keep stable performance at temperature -30~300
  • High performance
Applications:
  • Cooling device to the end plate heatsink
  • High speed and large storage Drives
  • Automotive Engine controls
  • Hard disk drive and DVD drives
  • Power conversion apparatus
  • High Power LEDs
  • Notebook and desktop computers
  • Network Communication Equipment
  • Household appliances, electronic components, electrical

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