12V Peltier Module Thermoelectric Cooler TEC1-12708

TEC1-12708 Performance is generally due to the power of the larger heat, so be sure to do the heat

Chip Model: TEC1-12708
Dimensions: 40 * 40 * 3.6mm element number 127
Wire specifications: wire lead length of 100 ± 5mm of RV standard single head 5mm tinned
Internal Resistance: 1.5 ~ 1.8Ω (ambient temperature 23 ± 1 ° C, 1kHZ of Ac test)
The maximum temperature difference:  Tmax (Qc = 0) 58 °C above.
Operating current: Imax = 8 (rated voltage start)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling power: Qcmax 48W
Assembly pressure: 85N/cm2
Working environment: temperature range -55 °C to 83 °C (too high ambient temperature will directly affect the cooling efficiency)
Packaging technology: around the standard 704 silicone rubber seal
Packaging standards: foam boxes for packaging, storage conditions of ambient temperature -10 °C to 40 °C
Storage conditions: -40 to 60 ° C  

 The refrigeration tablets principle introduced

The thermoelectric cooling thermoelectric effect is the application of the Peltier effect refrigeration technology. Practical thermoelectric cooling device is a thermoelectric effect was significantly more efficient thermoelectric cooling semiconductor thermocouple constituted.

Semiconductor thermocouple by the N-type semiconductor and P-type semiconductor. N-type materials have a surplus of electrons, and negative thermoelectric power. P-type materials, electronic, positive thermoelectric power; when electrons from the P-type through the node to the N-type, its energy must increase, and increase the energy equivalent of junction point of the energy consumed. This can be the difference in temperature reduce to prove.


The top of the thermopile cold junction, the following is the hot end. With the heat exchangers and other heat transfer means, so that the thermopile

On the contrary, when the electrons from the N-type flow to the P-type material, the junction temperature will rise. Direct contact with the thermocouple circuit in the actual reference is unavailable, so the above connection method instead, the experiments show that the introduction of a third material (copper lugs and wire) does not change the characteristics of the circuit in the temperature difference circuit.

In this way, the semiconductor element can be a variety of connection methods to meet the requirements of users. Links to a P-type semiconductor and an N-type semiconductor into the thermocouple, connected to the DC power supply, temperature difference and heat transfer in the joints will be in the joints above, the current direction of N to P, the temperature dropped and endothermic, this is the cold side. In one of the following joints, the direction of the current P to N, the temperature rise and heat, so is the hot end.

Several pairs of semiconductor thermocouple according to the figure in the circuit in series, while in the heat transfer in parallel, which constitutes a common cooling thermopile. By icons connected to the DC power supply, this side of the heat continue to heat and maintain a certain temperature, the cold junction of the thermopile into the work environment to endothermic cooling is thermoelectric cooling works.