Embedded Engineering Services: Our Expertise - Skills & Technologies

We are the specialized R&D and product engineering firm that thrives on complex hardware challenges. For visionary companies in India and the US, we are the partner of choice to translate ambitious ideas into robust, market-defining products for the most demanding applications.

This page details our complete, end-to-end technical capabilities, demonstrating how we manage every stage of the product lifecycle to de-risk your project and accelerate your time-to-market.

Before a single component is placed, we build the strategic foundation for success, ensuring your product is technically viable, cost-effective, and designed for its end-user.

• Technical & BoM Cost Feasibility: Rigorous analysis of architectures, component selection to ensure supply chain resilience, detailed Bill of Materials (BoM) cost-down strategies, and rapid Proof-of-Concept (PoC) development.
• Industrial & Mechanical Design: For products that will require mechanical integration, we offer Industrial & Mechanical Design services where we proactively integrate electronics and mechanics. We utilize DFM/DFA, thermal analysis (CFD), and ensure IP67/68 compliance from the outset. This prevents costly redesigns and delays by addressing potential mechanical integration challenges early, optimizing for technical viability, cost-effectiveness, and product robustness.
• Rapid Prototyping: Fast-turnaround functional prototypes using SLA/FDM 3D printing and CNC machining for immediate form-fit-function validation.

• Cloud Platforms: Deep expertise in AWS IoT Core, Microsoft Azure IoT Hub, and Google Cloud IoT Platform.
• Communication Protocols: MQTT, CoAP, LwM2M, and secure REST API development.
• Web & Mobile Applications: Custom web dashboards (React, Angular) and native mobile applications (iOS/Swift, Android/Kotlin).

We ensure your product is not only functional but also reliable, manufacturable, and compliant with global standards.

• Comprehensive Testing: Board bring-up, EVT, DVT, and automated stress and stability testing.
• Reliability & Failure Analysis: FMEA (Failure Mode and Effects Analysis) and MTBF (Mean Time Between Failures) prediction to ensure product longevity.
• Regulatory & EMI/EMC Certifications: Full support for CE, FCC, BIS, and other global standards, managed from design through to final certification.
• Production Test & Provisioning: Design and delivery of automated test fixtures (ATE) for the production line, mass firmware burning solutions, and secure provisioning (eFuse/OTP).

Our partnership continues post-launch to maximize your product's lifespan and profitability.

• Lifecycle Management: Post-launch value engineering for cost reduction, proactive component obsolescence management, and feature enhancement rollouts.

• Deep Niche Specialization: We excel at the challenges generic design houses avoid—from ISO 26262 functional safety to 100G Ethernet and AI at the edge.
• Mastery of Complexity: Our proven expertise in extreme high-speed design and standards like DO-254 de-risks your most ambitious projects.
• Future-Ready Expertise: We actively engineer with the technologies that will define the next decade, including PCIe6.0, RISC-V, and chiplet architectures.
• Engineering for Excellence (DFX): Our integrated DFM/DFA/DFT approach is built into our process, reducing respins and accelerating your time-to-market.

1. Do you handle the entire product development lifecycle?
   Yes. We are an end-to-end partner. We can take your product from an initial concept sketch through feasibility, design, prototyping, certification, and all the way to production handoff and post-launch support.
2. How do you protect our Intellectual Property (IP)?
   Your IP is paramount. We execute robust NDAs before any technical discussion and follow strict internal security protocols, including secure servers and access controls, to ensure your data and designs are completely confidential.
3. What is your typical engagement model?
   We are flexible and can work with Time & Material (T&M) models for R&D-heavy projects or Fixed-Price models for well-defined scopes. We tailor the engagement to best suit your project needs.
4. Can you help us scale from a prototype to mass production?
   Yes. Our DFX process ensures your design is ready for mass production. We develop automated test fixtures for the production line and provide full support during the pilot production and ramp-up phases to ensure a smooth transition.
5. What is the first step to starting a project with you?
   Simply use our contact form or email us. The first step is a discovery call where we sign an NDA and then dive deep into your technical and business requirements to understand your vision and challenges.

1. What makes your approach to high-speed design different?
   We treat it as "channel engineering," not just "routing." Our process involves extensive pre- and post-layout simulation (SI/PI) using tools like Ansys HFSS to ensure performance is designed-in for interfaces like PCIe 6.0 and DDR5, minimizing board respins.
2. How do you approach functional safety for industries like Automotive or Industrial?
   We integrate safety standards from the beginning of the design process. For Automotive, this means following an ISO 26262-compliant workflow. For Industrial, we design to meet SIL requirements, incorporating features like redundant processors, watchdogs, and certified RTOS components.
3. What is your experience with Yocto and Buildroot?
   We are experts in creating custom, minimal, and secure Linux distributions. We don't just configure BSPs; we write custom recipes, build custom layers, optimize boot times to under a second, and implement secure OTA update strategies using Mender or SWUpdate.
4. Can you deploy ML models on resource-constrained microcontrollers?
   Yes, this is a core specialty. We use frameworks like TensorFlow Lite for Microcontrollers and Edge Impulse to quantize, prune, and deploy models on MCUs from ST, NXP, and Ambiq. This enables applications like sensor-based anomaly detection and keyword spotting with minimal power consumption.
5. Do you design custom RF antennas in-house?
   Yes. We have in-house RF expertise to design and simulate custom PCB trace antennas or select and integrate chip antennas. We use tools like Ansys HFSS and perform impedance matching with a VNA to ensure optimal performance for protocols like Wi-Fi, Bluetooth, and LoRa.
6. What is your expertise with emerging IoT standards like Matter?
   We are actively developing with Matter. Our expertise in Thread, Wi-Fi, and Bluetooth